Xbox 360 rrod problem
A PROFFESIONAL REPAIR CANNOT BE DONE WITH OVEN OR HEAT GUN
TOWEL TRICKS AND AMATEUR REPAIR CAN PERMANENTLY DAMAGE YOUR CONSOLE
Infra Red reflow of Xbox GPU at our electronic workshop in Manchester.
You may remember a big fuss that was made a few years ago, about the amount of LEAD, contained in paint, on children's toy coming from China. Health and Safety issues got the Chinese acting to reduce the amount of LEAD in everything. This made a massive switch in Chinese electronics to LEAD-FREE solder.
Electronic goods designed under the specifications of normal solder containing LEAD, have begun to suffer serious failures due to the different properties of LEAD-FREE solder. Over time the solder can disconnect from its electronic connection points and cause failure of the component it was connecting to.
The Ring of Death on the Xbox 360 is caused by this problem. Over time, due to the high temperature that the Xbox works at The solder is disconnecting from the BGA chips mounted on the Xbox360 motherboard. The solder itself can crack overtime as demonstrated in the picture below:
The only reliable method of repairing this problem, is to reflow the solder on the BGA chip. This can ONLY be done reliably, using an INFRA RED BGA REWORK STATION.
Methods involving putting the main board in an oven, will not repair the solder joints. All the plastic components on the board would melt before the correct temperature (required to re flow the solder) would be reached.
Xbox 360 Ring of Death Repair / fix - £40 + £15 c&d UK
If you have attempted to repair the Xbox 360 yourself or have had someone else try to repair it using the 'towel trick' or heating the main board, do not use this service. Heating the main board causes it to warp, the more times this is done the more damaged the board becomes. A correct reflow requires the board to be un warped. We will charge a fee of £20 to work on Xbox 360 consoles that have had amateur repair attempts performed on them.
The Only way to properly repair this problem is to use an Infra Red BGA reflow of the solder.
